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Resources

Brochures and One Pagers: 01/18/24

Innovation and Competitiveness: U.S. Chip Design Leadership in the 21st Century

Chip Design and R&DResearchTax
Comments and Letters: 01/17/24

SIA Comments to BIS on Semiconductor Manufacturing IFR

Export Control and National Security Policy
Comments and Letters: 01/17/24

SIA Comments to BIS on Advanced Computing IFR

Export Control and National Security Policy
Historical Billings Reports: 01/10/24

Global Billings Report History (3-month moving average) 1976 – November 2023

Market Data
Comments and Letters: 01/08/24

SIA Comments to EPA on Use of PIP (3:1) in Semiconductor Manufacturing Equipment – Proposed Revision

Environment, Health & Safety
Comments and Letters: 12/20/23

SIA, TechNet, & ITI Comments on H-1B Modernization Rule

Workforce & Immigration
Comments and Letters: 12/18/23

SIA Comments to EPA on Management of Certain Hydrofluorocarbons and Substitutes Under Subsection (h) of the AIM Act

Environment, Health & Safety
Comments and Letters: 11/17/23

SIA comments to EPA on the Air Emissions Reporting Requirement

Environment, Health & Safety
Comments and Letters: 10/17/23

Multi-Association Letter on the Sale of the Federal Helium Reserve System

Environment, Health & SafetySupply Chain Security
Comments and Letters: 09/28/23

SIA Comments on Treasury Outbound ANPRM

Export Control and National Security Policy
Comments and Letters: 09/18/23

SIA Letter to Congress re U.S.-Taiwan Taxation

Tax
Comments and Letters: 08/15/23

SIA Comments to EPA on PCE Proposed Rule

Environment, Health & Safety

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