Back-end manufacturing turns a into as many as tens of thousands of ready-to-use chips. The process consists of the steps listed below.
- Dicing: the fabricated wafer is cut into individual dies
- Die attach: is mounted onto a substrate base—see sidebar below to learn more about conventional vs. advanced packaging.
- Bonding: Electrical connections are made between the die(s) and external connectors.
- Encapsulation: the packaged die(s) is sealed in a protective casing resulting in a chip.
- Testing: Chips are inspected to ensure that the packaged chip performs correctly.
The result is a fully-tested chip that is ready for integration into a circuit in a wide-range of goods—e.g., computers, phones, cars, Etc.
